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8-Mic Array microphone for Video Conferencing – 360° Full-Coverage (Dual 180°) – Camera Hub Support – Split-Type Module
Qwen3.7-Max Product Keywords 8-Mic Array Module, Circular Microphone Array, 360° Omnidirectional Pickup, USB Audio Module, Far-Field Voice Capture, Beamforming Microphone, AEC Noise Suppression, Conference System Microphone, Smart Speaker Mic Array, Embedded Audio Solution, UAC1.0 Microphone, DSP Audio Processing, Multi-Microphone Array, Voice Enhancement Module, Intelligent Meeting Device
Qwen3.7-Max Product Keywords 8-Mic Array Module, Circular Microphone Array, 360° Omnidirectional Pickup, USB Audio Module, Far-Field Voice Capture, Beamforming Microphone, AEC Noise Suppression, Conference System Microphone, Smart Speaker Mic Array, Embedded Audio Solution, UAC1.0 Microphone, DSP Audio Processing, Multi-Microphone Array, Voice Enhancement Module, Intelligent Meeting Device
8-Mic Array microphone for Video Conferencing – 360° Full-Coverage (Dual 180°) – Camera Hub Support – Split-Type Module - 图片 4
8-Mic Array microphone for Video Conferencing – 360° Full-Coverage (Dual 180°) – Camera Hub Support – Split-Type Module - 图片 5
8-Mic Array microphone for Video Conferencing – 360° Full-Coverage (Dual 180°) – Camera Hub Support – Split-Type Module - 图片 6
8-Mic Array microphone for Video Conferencing – 360° Full-Coverage (Dual 180°) – Camera Hub Support – Split-Type Module - 图片 7
Qwen3.7-Max Product Keywords 8-Mic Array Module, Circular Microphone Array, 360° Omnidirectional Pickup, USB Audio Module, Far-Field Voice Capture, Beamforming Microphone, AEC Noise Suppression, Conference System Microphone, Smart Speaker Mic Array, Embedded Audio Solution, UAC1.0 Microphone, DSP Audio Processing, Multi-Microphone Array, Voice Enhancement Module, Intelligent Meeting Device
Qwen3.7-Max Product Keywords 8-Mic Array Module, Circular Microphone Array, 360° Omnidirectional Pickup, USB Audio Module, Far-Field Voice Capture, Beamforming Microphone, AEC Noise Suppression, Conference System Microphone, Smart Speaker Mic Array, Embedded Audio Solution, UAC1.0 Microphone, DSP Audio Processing, Multi-Microphone Array, Voice Enhancement Module, Intelligent Meeting Device

8-Mic Array microphone for Video Conferencing – 360° Full-Coverage (Dual 180°) – Camera Hub Support – Split-Type Module

原价为：$45.00。当前价格为：$32.00。

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This is an 8-element omnidirectional MEMS microphone array with a linear design and USB 2.0 connectivity. Optimized for professional video conferencing, large display terminals and Android systems, it delivers premium audio for modern collaboration.
Featuring dual 180° beamforming, it enables true 360° omnidirectional pickup. With built-in camera hub support and a modular structure, it offers exceptional flexibility for high-end conference applications.
Powered by an advanced 8-channel algorithm, the array integrates stereo echo cancellation, voice enhancement, beamforming, noise suppression and automatic gain control (AGC). It captures clear voice from 6–10 meters, meeting the strict demands of professional conferencing systems.
Supporting USB Audio Class 1.0 (UAC 1.0) and USB control debugging, it works seamlessly with USB cameras via HUB connection. It is widely compatible with Windows VISTA, Linux 2.6.24 and above, ensuring stable deployment across platforms.

Product Keywords

8-Mic Array Module, Circular Microphone Array, 360° Omnidirectional Pickup, USB Audio Module, Far-Field Voice Capture, Beamforming Microphone, AEC Noise Suppression, Conference System Microphone, Smart Speaker Mic Array, Embedded Audio Solution, UAC1.0 Microphone, DSP Audio Processing, Multi-Microphone Array, Voice Enhancement Module, Intelligent Meeting Device Component

Product Features

  • 360° Omnidirectional Coverage: Adopts a circular 8-microphone array layout to achieve full 360° horizontal pickup with no blind spots, ensuring equal voice capture quality for all participants in medium-to-large conference rooms or open spaces.
  • Advanced DSP Algorithm Integration: Built-in hardware DSP supports Acoustic Echo Cancellation (AEC), Noise Suppression (NS), Automatic Gain Control (AGC), and adaptive beamforming, effectively filtering out ambient noise, reverberation, and echo while enhancing target voice clarity in complex acoustic environments.
  • Far-Field High-Fidelity Capture: Optimized for far-field voice pickup up to 5–6 meters, maintaining high signal-to-noise ratio (≥65dB) and low distortion even at extended distances, making it ideal for large meeting rooms, lecture halls, and smart public terminals.
  • Plug-and-Play USB Interface: Compliant with USB Audio Class 1.0 (UAC1.0) standard, driver-free compatibility with Windows, Linux, Android, and macOS systems; single USB Type-C/A connection provides both power and audio data transmission, simplifying integration into existing devices.
  • Compact & Flexible Embedding Design: Modular form factor with separated mainboard and mic array board allows flexible installation in space-constrained devices; supports OEM/ODM customization for size, mounting holes, firmware tuning, and interface adaptation to meet specific product requirements.
  • Multi-Scenario Adaptability: Engineered for diverse applications including video conferencing systems, smart speakers, AI voice assistants, telemedicine terminals, and intelligent education equipment, delivering consistent professional-grade audio performance across different use cases.
Parameter Specification
Microphone Array Circular 8-mic array
Pickup Pattern 360° omnidirectional horizontal coverage
Effective Pickup Distance Up to 5–6 meters (far-field)
Audio Sampling Rate 48 kHz / 16-bit
Signal-to-Noise Ratio (SNR) ≥65 dB (A-weighted)
Sensitivity -26 ±1 dB (re: 1V/Pa)
Acoustic Overload Point (AOP) 120 dB SPL
Supported DSP Functions AEC, NS, AGC, Adaptive Beamforming, Voice Enhancement
Interface Type USB Audio Class 1.0 (UAC1.0), Driver-free
Connector USB Type-C / Type-A (customizable)
Power Supply USB 5V ±5%
Power Consumption ≤1W (Typical)
OS Compatibility Windows, Linux, Android, macOS
Main Board Dimensions Customizable (refer to mechanical drawing)
Mic Array Board Diameter Customizable (refer to mechanical drawing)
Operating Temperature -20°C ~ +60°C
Storage Temperature -40°C ~ +85°C

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