640*512 high-precision thermal imaging camera module, USB interface, night vision security drone, supports SDK development
This thermal imaging module utilizes a 640×512 high-resolution infrared sensor, boasting excellent thermal sensitivity and temperature measurement accuracy, making it suitable for all-weather monitoring in complex lighting environments. Equipped with a standard USB interface, the module is plug-and-play, highly compatible, and can be easily integrated into night vision security systems, industrial inspection equipment, and various drone platforms. The product supports multi-platform SDK development, providing rich API interfaces and development documentation, facilitating rapid secondary development and feature customization. Whether for forest fire prevention, power line inspection, border security, or emergency rescue scenarios, this module provides a stable and reliable thermal imaging solution, contributing to the efficient operation of intelligent sensing systems.
- Ultra-high resolution：640×512 IR sensor with <50mK sensitivity detects subtle temperature differences for night surveillance and industrial inspection.
- Superior thermal sensitivity：NETD ≤40mK (@25℃, F#1.0), sensitively detecting even minute temperature differences
- High-speed frame rate support：30/60Hz adaptive frame rate for smooth, ghosting-free dynamic scenes
- Full interface compatibility：Multiple digital/analog outputs including USB 2.0 / MIPI / DVP / BT656 / CVBS, adaptable to various platforms
- Ultra-low power consumption design: Typical power consumption <0.7W (USB output @25℃), lightweight and efficient, especially suitable for drones and portable devices
- Extremely compact and lightweight: Only 21×21×10.3mm, weighing <8.6g (excluding lens), easily integrated into space-constrained systems
- Military-grade reliability: Operating temperature… -40℃ to +80℃, vibration resistant (6.06g), shock resistant (80g), fearless of harsh environments
- Intelligent image processing: supports shutter/no shutter correction, incandescent/black-and-white/multicolor palette, 1–8x continuous digital zoom, mirror flip, etc.
- Open SDK support: provides UART/I²C/USB communication interfaces and a complete development kit to accelerate product integration and customized development.
Detail Information
| Type: | thermal Camera Module | Sensor: | 640×512 |
|---|---|---|---|
| Detector Type: | Vanadium Oxide Uncooled Infrared Focal Plane Detector | Effective Frame Rate: | 30/60Hz |
| Digital Video: | DVP/BT656/USB2.0/MIPI/CVBS | Noise Equivalent Temperature Difference (NETD): | ≤40mK@25℃,F#1.0,25Hz |
| Non-uniformity Correction: | Shutter correction/shutter-less algorithm correction | Dimensions(without lens) | 21x21x10.3 mm |
Key Feature:
- 640×512 thermal imaging module
- High-resolution infrared camera core
- NETD ≤40mK thermal sensitivity
- 30Hz / 60Hz frame rate
- USB 2.0 thermal camera
- Multi-interface output: MIPI, DVP, CVBS, BT.656
- Ultra-low power consumption (<0.7W)
- Compact thermal module (21×21×10.3mm)
- Lightweight thermal sensor (<8.6g)
Specification
| Overview | Mini2 | ||
| Detector Type | Vanadium Oxide Uncooled Infrared Focal Plane Detector | ||
| Resolution | 256×192 | 384×288 | 640×512 |
| Effective Frame Rate | 25/50Hz | 30/60Hz | 30/60Hz |
| Pixel Pitch | 12um | ||
| Spectral Band | 8~14um | ||
| Noise Equivalent Temperature Difference (NETD) | ≤40mK@25℃,F#1.0,25Hz | ||
| Thermal Time Constant | <12ms | ||
| lmage Adjustment | |||
| Non-uniformity Correction | Shutter correction/shutter-less algorithm correction | ||
| Brightness/Contrast Adjustment | 0~100, optional | ||
| Polarity/Palette | White-hot/Black-hot/Various palettes supported | ||
| Digital zoom | 1.0~8.0xcontinuous zoom(step size: 0.1) | ||
| lmage Mirroring | Vertical/Horizontal/Diagonal | ||
| Electricity Parameters | |||
| Analog Video | PAL/NTSC | ||
| Digital Video | DVP/BT656/USB2.0/MIPI/CVBS | ||
| Communication Interface | UART/I2C/USB2.0 | ||
| Power Supply input | 5V | ||
| Typical power consumption of USB output @25℃ | <0.35W | <0.42W | <0.7W |
| Physical Characteristics | |||
| Weight (without lens) | <7g | <8.6g | |
| Dimensions(without lens) | 21x21x10.3 mm | ||
| Environment Adaptability | |||
| Operating Temperature | -40℃~+80℃ | ||
| Storage Temperature | -50℃~+85℃ | ||
| Humidity | 5%-95%, non-condensing | ||
| Vibration | 6.06g,random vibration, all axes | ||
| Impact | 80g, 4ms, final peak sawtooth wave, three axes and six directions | ||
Product photos
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Imaging and vision solutions Integrated complex and customized technology
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Infrared Imagers for Industry Embedded Systems solutions
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Shenzhen HSTD Import and Trade Co., Ltd.,
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